Vulnerabilites related to Qualcomm, Inc. - Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
CVE-2022-22081 (GCVE-0-2022-22081)
Vulnerability from cvelistv5
Published
2022-09-16 05:25
Modified
2024-08-03 03:00
Severity ?
8.4 (High) - CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
CWE
  • Buffer Over-read in Audio
Summary
Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
References
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Version: AR8035, QCA6595AU, QCA8081, QCA8337, SA6155P, SA8155P, SA8195P, SD 8 Gen1 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, SW5100, SW5100P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3980, WCN3988, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835
 Create a notification for this product.
Show details on NVD website

To clipboard 

{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-03T03:00:55.231Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "AR8035, QCA6595AU, QCA8081, QCA8337, SA6155P, SA8155P, SA8195P, SD 8 Gen1 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, SW5100, SW5100P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3980, WCN3988, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"
        }
      ],
      "metrics": [
        {
          "cvssV3_1": {
            "attackComplexity": "LOW",
            "attackVector": "LOCAL",
            "availabilityImpact": "HIGH",
            "baseScore": 8.4,
            "baseSeverity": "HIGH",
            "confidentialityImpact": "HIGH",
            "integrityImpact": "HIGH",
            "privilegesRequired": "NONE",
            "scope": "UNCHANGED",
            "userInteraction": "NONE",
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Buffer Over-read in Audio",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2022-09-16T05:25:43",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2022-22081",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "AR8035, QCA6595AU, QCA8081, QCA8337, SA6155P, SA8155P, SA8195P, SD 8 Gen1 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, SW5100, SW5100P, WCD9370, WCD9375, WCD9380, WCD9385, WCN3980, WCN3988, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"
            }
          ]
        },
        "impact": {
          "cvss": {
            "baseScore": 8.4,
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Buffer Over-read in Audio"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2022-22081",
    "datePublished": "2022-09-16T05:25:44",
    "dateReserved": "2021-12-21T00:00:00",
    "dateUpdated": "2024-08-03T03:00:55.231Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}

CVE-2021-1958 (GCVE-0-2021-1958)
Vulnerability from cvelistv5
Published
2021-09-09 07:35
Modified
2024-08-03 16:25
Severity ?
6.7 (Medium) - CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
CWE
  • Use After Free in DSP Services
Summary
A race condition in fastrpc kernel driver for dynamic process creation can lead to use after free scenario in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables
References
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Version: QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SD480, SD778G, SD780G, SD888 5G, SDA429W, SM7315, SM7325P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3980, WCN3988, WCN3991, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8830, WSA8835
 Create a notification for this product.
Show details on NVD website

To clipboard 

{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-03T16:25:06.519Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2021-bulletin"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SD480, SD778G, SD780G, SD888 5G, SDA429W, SM7315, SM7325P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3980, WCN3988, WCN3991, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8830, WSA8835"
            }
          ]
        }
      ],
      "descriptions": [
        {
          "lang": "en",
          "value": "A race condition in fastrpc kernel driver for dynamic process creation can lead to use after free scenario in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"
        }
      ],
      "metrics": [
        {
          "cvssV3_1": {
            "attackComplexity": "LOW",
            "attackVector": "LOCAL",
            "availabilityImpact": "HIGH",
            "baseScore": 6.7,
            "baseSeverity": "MEDIUM",
            "confidentialityImpact": "HIGH",
            "integrityImpact": "HIGH",
            "privilegesRequired": "HIGH",
            "scope": "UNCHANGED",
            "userInteraction": "NONE",
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Use After Free in DSP Services",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2021-09-09T07:35:57",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2021-bulletin"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2021-1958",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SA8195P, SD480, SD778G, SD780G, SD888 5G, SDA429W, SM7315, SM7325P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3980, WCN3988, WCN3991, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8830, WSA8835"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "A race condition in fastrpc kernel driver for dynamic process creation can lead to use after free scenario in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"
            }
          ]
        },
        "impact": {
          "cvss": {
            "baseScore": 6.7,
            "vectorString": "CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H",
            "version": "3.1"
          }
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Use After Free in DSP Services"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins/september-2021-bulletin",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins/september-2021-bulletin"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2021-1958",
    "datePublished": "2021-09-09T07:35:57",
    "dateReserved": "2020-12-08T00:00:00",
    "dateUpdated": "2024-08-03T16:25:06.519Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1"
}