CVE-2017-18313 (GCVE-0-2017-18313)
Vulnerability from cvelistv5
Published
2018-10-23 13:00
Modified
2024-08-05 21:20
Severity ?
CWE
  • Improper Access Control in WLAN
Summary
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Impacted products
Vendor Product Version
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear Version: MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617
Create a notification for this product.
Show details on NVD website


{
  "containers": {
    "adp": [
      {
        "providerMetadata": {
          "dateUpdated": "2024-08-05T21:20:49.924Z",
          "orgId": "af854a3a-2127-422b-91ae-364da2661108",
          "shortName": "CVE"
        },
        "references": [
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
          },
          {
            "tags": [
              "x_refsource_CONFIRM",
              "x_transferred"
            ],
            "url": "https://www.qualcomm.com/company/product-security/bulletins"
          }
        ],
        "title": "CVE Program Container"
      }
    ],
    "cna": {
      "affected": [
        {
          "product": "Snapdragon Mobile, Snapdragon Wear",
          "vendor": "Qualcomm, Inc.",
          "versions": [
            {
              "status": "affected",
              "version": "MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617"
            }
          ]
        }
      ],
      "datePublic": "2018-09-04T00:00:00",
      "descriptions": [
        {
          "lang": "en",
          "value": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617."
        }
      ],
      "problemTypes": [
        {
          "descriptions": [
            {
              "description": "Improper Access Control in WLAN",
              "lang": "en",
              "type": "text"
            }
          ]
        }
      ],
      "providerMetadata": {
        "dateUpdated": "2018-10-23T12:57:01",
        "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
        "shortName": "qualcomm"
      },
      "references": [
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
        },
        {
          "tags": [
            "x_refsource_CONFIRM"
          ],
          "url": "https://www.qualcomm.com/company/product-security/bulletins"
        }
      ],
      "x_legacyV4Record": {
        "CVE_data_meta": {
          "ASSIGNER": "product-security@qualcomm.com",
          "ID": "CVE-2017-18313",
          "STATE": "PUBLIC"
        },
        "affects": {
          "vendor": {
            "vendor_data": [
              {
                "product": {
                  "product_data": [
                    {
                      "product_name": "Snapdragon Mobile, Snapdragon Wear",
                      "version": {
                        "version_data": [
                          {
                            "version_value": "MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617"
                          }
                        ]
                      }
                    }
                  ]
                },
                "vendor_name": "Qualcomm, Inc."
              }
            ]
          }
        },
        "data_format": "MITRE",
        "data_type": "CVE",
        "data_version": "4.0",
        "description": {
          "description_data": [
            {
              "lang": "eng",
              "value": "Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617."
            }
          ]
        },
        "problemtype": {
          "problemtype_data": [
            {
              "description": [
                {
                  "lang": "eng",
                  "value": "Improper Access Control in WLAN"
                }
              ]
            }
          ]
        },
        "references": {
          "reference_data": [
            {
              "name": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components",
              "refsource": "CONFIRM",
              "url": "https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components"
            },
            {
              "name": "https://www.qualcomm.com/company/product-security/bulletins",
              "refsource": "CONFIRM",
              "url": "https://www.qualcomm.com/company/product-security/bulletins"
            }
          ]
        }
      }
    }
  },
  "cveMetadata": {
    "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f",
    "assignerShortName": "qualcomm",
    "cveId": "CVE-2017-18313",
    "datePublished": "2018-10-23T13:00:00",
    "dateReserved": "2018-06-15T00:00:00",
    "dateUpdated": "2024-08-05T21:20:49.924Z",
    "state": "PUBLISHED"
  },
  "dataType": "CVE_RECORD",
  "dataVersion": "5.1",
  "vulnerability-lookup:meta": {
    "nvd": "{\"cve\":{\"id\":\"CVE-2017-18313\",\"sourceIdentifier\":\"product-security@qualcomm.com\",\"published\":\"2018-10-23T13:29:02.837\",\"lastModified\":\"2024-11-21T03:19:50.010\",\"vulnStatus\":\"Modified\",\"cveTags\":[],\"descriptions\":[{\"lang\":\"en\",\"value\":\"Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.\"},{\"lang\":\"es\",\"value\":\"En ciertos modos de operaciones, HLOS podr\u00eda ser capaz de obtener acceso directo o indirecto mediante los canales DXE para manipular el firmware WCNSS autenticado almacenado en DDR debido a que la memoria DXE accesible se ubica en la imagen autenticada en Snapdragon Mobile y Snapdragon Wear en versiones MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415 y SD 617.\"}],\"metrics\":{\"cvssMetricV30\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"3.0\",\"vectorString\":\"CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N\",\"baseScore\":5.3,\"baseSeverity\":\"MEDIUM\",\"attackVector\":\"ADJACENT_NETWORK\",\"attackComplexity\":\"HIGH\",\"privilegesRequired\":\"NONE\",\"userInteraction\":\"NONE\",\"scope\":\"UNCHANGED\",\"confidentialityImpact\":\"NONE\",\"integrityImpact\":\"HIGH\",\"availabilityImpact\":\"NONE\"},\"exploitabilityScore\":1.6,\"impactScore\":3.6}],\"cvssMetricV2\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"cvssData\":{\"version\":\"2.0\",\"vectorString\":\"AV:A/AC:M/Au:N/C:N/I:C/A:N\",\"baseScore\":5.7,\"accessVector\":\"ADJACENT_NETWORK\",\"accessComplexity\":\"MEDIUM\",\"authentication\":\"NONE\",\"confidentialityImpact\":\"NONE\",\"integrityImpact\":\"COMPLETE\",\"availabilityImpact\":\"NONE\"},\"baseSeverity\":\"MEDIUM\",\"exploitabilityScore\":5.5,\"impactScore\":6.9,\"acInsufInfo\":false,\"obtainAllPrivilege\":false,\"obtainUserPrivilege\":false,\"obtainOtherPrivilege\":false,\"userInteractionRequired\":false}]},\"weaknesses\":[{\"source\":\"nvd@nist.gov\",\"type\":\"Primary\",\"description\":[{\"lang\":\"en\",\"value\":\"NVD-CWE-noinfo\"}]}],\"configurations\":[{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"FE28A59C-7AA6-4B85-84E8-07852B96108E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"5DEE828B-09A7-4AC1-8134-491A7C87C118\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0FA80D57-3191-47CF-AD3F-9F2D64E443FE\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"B2AFB212-F01A-4CEB-8DB4-2E0CC2308CB6\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"E0986EF1-0974-488E-84C4-6880F876CE55\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"8C08BA58-2EBC-4A22-85A4-2ECD54693B9B\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"27110478-4C08-49E6-BD53-8BAAD9D5BD65\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"3664D302-D22A-4B25-B534-3097AE2F8573\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"F683C42D-A310-4369-9689-3DBC9288591E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"0EADE10A-0F63-4149-8F03-030673D6D7CE\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A78C9449-5EB0-459B-AA72-EFF00592C30A\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"2D583172-F1F1-4DF8-99CE-B94A84D14CCD\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"549E6F7E-A54F-423F-BD4A-A8FB97DBD39E\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"992C3835-7183-4D96-8647-DD9916880323\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"A7B95CCC-37F1-4768-8D64-CA2028E93E03\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D1426161-4F7C-44B1-AA9E-EA661AA68947\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"ECF81213-DE2D-4C4B-99E8-71AFD87E92CD\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"95E826EF-343B-47FA-AB54-F13E868CE6A7\"}]}]},{\"operator\":\"AND\",\"nodes\":[{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":true,\"criteria\":\"cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"D27A1760-8D1B-4172-B6CE-65C72332F103\"}]},{\"operator\":\"OR\",\"negate\":false,\"cpeMatch\":[{\"vulnerable\":false,\"criteria\":\"cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:*\",\"matchCriteriaId\":\"CC5F96F1-D3FB-482B-A3C8-57BA4DE86D5E\"}]}]}],\"references\":[{\"url\":\"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Third Party Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"product-security@qualcomm.com\",\"tags\":[\"Vendor Advisory\"]},{\"url\":\"https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Third Party Advisory\"]},{\"url\":\"https://www.qualcomm.com/company/product-security/bulletins\",\"source\":\"af854a3a-2127-422b-91ae-364da2661108\",\"tags\":[\"Vendor Advisory\"]}]}}"
  }
}


Log in or create an account to share your comment.




Tags
Taxonomy of the tags.


Loading…

Loading…

Loading…

Sightings

Author Source Type Date

Nomenclature

  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
  • Confirmed: The vulnerability is confirmed from an analyst perspective.
  • Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
  • Patched: This vulnerability was successfully patched by the user reporting the sighting.
  • Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
  • Not confirmed: The user expresses doubt about the veracity of the vulnerability.
  • Not patched: This vulnerability was not successfully patched by the user reporting the sighting.


Loading…

Loading…