fkie_cve-2017-18173
Vulnerability from fkie_nvd
Published
2019-05-06 23:29
Modified
2024-11-21 03:19
Summary
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.



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      "lang": "en",
      "value": "In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016."
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  "id": "CVE-2017-18173",
  "lastModified": "2024-11-21T03:19:28.997",
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  "published": "2019-05-06T23:29:00.487",
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      "source": "product-security@qualcomm.com",
      "tags": [
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  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
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