fkie_cve-2017-18305
Vulnerability from fkie_nvd
Published
2018-10-23 13:29
Modified
2024-11-21 03:19
Severity ?
7.0 (High) - CVSS:3.0/AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H
Summary
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
References
product-security@qualcomm.comhttp://www.securitytracker.com/id/1041432Third Party Advisory, VDB Entry
product-security@qualcomm.comhttps://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentsThird Party Advisory
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
af854a3a-2127-422b-91ae-364da2661108http://www.securitytracker.com/id/1041432Third Party Advisory, VDB Entry
af854a3a-2127-422b-91ae-364da2661108https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentsThird Party Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Impacted products
Vendor Product Version
qualcomm mdm9206_firmware -
qualcomm mdm9206 -
qualcomm mdm9607_firmware -
qualcomm mdm9607 -
qualcomm mdm9650_firmware -
qualcomm mdm9650 -
qualcomm sd_210_firmware -
qualcomm sd_210 -
qualcomm sd_212_firmware -
qualcomm sd_212 -
qualcomm sd_205_firmware -
qualcomm sd_205 -
qualcomm sd_835_firmware -
qualcomm sd_835 -


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