fkie_cve-2018-5878
Vulnerability from fkie_nvd
Published
2018-07-06 17:29
Modified
2024-11-21 04:09
Severity ?
Summary
While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
References
Impacted products
| Vendor | Product | Version | |
|---|---|---|---|
| qualcomm | mdm9206_firmware | - | |
| qualcomm | mdm9206 | - | |
| qualcomm | mdm9607_firmware | - | |
| qualcomm | mdm9607 | - | |
| qualcomm | mdm9635m_firmware | - | |
| qualcomm | mdm9635m | - | |
| qualcomm | mdm9650_firmware | - | |
| qualcomm | mdm9650 | - | |
| qualcomm | sd_210_firmware | - | |
| qualcomm | sd_210 | - | |
| qualcomm | sd_212_firmware | - | |
| qualcomm | sd_212 | - | |
| qualcomm | sd_205_firmware | - | |
| qualcomm | sd_205 | - | |
| qualcomm | sd_615_firmware | - | |
| qualcomm | sd_615 | - | |
| qualcomm | sd_616_firmware | - | |
| qualcomm | sd_616 | - | |
| qualcomm | sd_415_firmware | - | |
| qualcomm | sd_415 | - | |
| qualcomm | sd_625_firmware | - | |
| qualcomm | sd_625 | - | |
| qualcomm | sd_835_firmware | - | |
| qualcomm | sd_835 | - |
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"id": "CVE-2018-5878",
"lastModified": "2024-11-21T04:09:37.333",
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"published": "2018-07-06T17:29:01.710",
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Sightings
| Author | Source | Type | Date |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
- Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.
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