fkie_cve-2019-2288
Vulnerability from fkie_nvd
Published
2019-12-12 09:15
Modified
2024-11-21 04:40
Severity ?
Summary
Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130
References
Impacted products
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Sightings
| Author | Source | Type | Date |
|---|
Nomenclature
- Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
- Confirmed: The vulnerability is confirmed from an analyst perspective.
- Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
- Patched: This vulnerability was successfully patched by the user reporting the sighting.
- Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
- Not confirmed: The user expresses doubt about the veracity of the vulnerability.
- Not patched: This vulnerability was not successfully patched by the user reporting the sighting.
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