fkie_cve-2025-21486
Vulnerability from fkie_nvd
Published
2025-06-03 06:15
Modified
2025-08-20 20:25
Summary
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.
Impacted products
Vendor Product Version
qualcomm fastconnect_6900_firmware -
qualcomm fastconnect_6900 -
qualcomm fastconnect_7800_firmware -
qualcomm fastconnect_7800 -
qualcomm qmp1000_firmware -
qualcomm qmp1000 -
qualcomm sm8735_firmware -
qualcomm sm8735 -
qualcomm sm8750_firmware -
qualcomm sm8750 -
qualcomm sm8750p_firmware -
qualcomm sm8750p -
qualcomm snapdragon_w5\+_gen_1_wearable_platform_firmware -
qualcomm snapdragon_w5\+_gen_1_wearable_platform -
qualcomm sw5100_firmware -
qualcomm sw5100 -
qualcomm sw5100p_firmware -
qualcomm sw5100p -
qualcomm sxr2230p_firmware -
qualcomm sxr2230p -
qualcomm sxr2250p_firmware -
qualcomm sxr2250p -
qualcomm sxr2330p_firmware -
qualcomm sxr2330p -
qualcomm wcd9378_firmware -
qualcomm wcd9378 -
qualcomm wcd9380_firmware -
qualcomm wcd9380 -
qualcomm wcd9385_firmware -
qualcomm wcd9385 -
qualcomm wcd9395_firmware -
qualcomm wcd9395 -
qualcomm wcn3660b_firmware -
qualcomm wcn3660b -
qualcomm wcn3680b_firmware -
qualcomm wcn3680b -
qualcomm wcn3980_firmware -
qualcomm wcn3980 -
qualcomm wcn3988_firmware -
qualcomm wcn3988 -
qualcomm wcn7750_firmware -
qualcomm wcn7750 -
qualcomm wcn7860_firmware -
qualcomm wcn7860 -
qualcomm wcn7861_firmware -
qualcomm wcn7861 -
qualcomm wcn7880_firmware -
qualcomm wcn7880 -
qualcomm wcn7881_firmware -
qualcomm wcn7881 -
qualcomm wsa8830_firmware -
qualcomm wsa8830 -
qualcomm wsa8832_firmware -
qualcomm wsa8832 -
qualcomm wsa8835_firmware -
qualcomm wsa8835 -
qualcomm wsa8840_firmware -
qualcomm wsa8840 -
qualcomm wsa8845_firmware -
qualcomm wsa8845 -
qualcomm wsa8845h_firmware -
qualcomm wsa8845h -



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  "cveTags": [],
  "descriptions": [
    {
      "lang": "en",
      "value": "Memory corruption during dynamic process creation call when client is only passing address and length of shell binary."
    },
    {
      "lang": "es",
      "value": "Corrupci\u00f3n de memoria durante la llamada de creaci\u00f3n de proceso din\u00e1mico cuando el cliente solo pasa la direcci\u00f3n y la longitud del binario del shell."
    }
  ],
  "id": "CVE-2025-21486",
  "lastModified": "2025-08-20T20:25:35.943",
  "metrics": {
    "cvssMetricV31": [
      {
        "cvssData": {
          "attackComplexity": "LOW",
          "attackVector": "LOCAL",
          "availabilityImpact": "HIGH",
          "baseScore": 7.8,
          "baseSeverity": "HIGH",
          "confidentialityImpact": "HIGH",
          "integrityImpact": "HIGH",
          "privilegesRequired": "LOW",
          "scope": "UNCHANGED",
          "userInteraction": "NONE",
          "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
          "version": "3.1"
        },
        "exploitabilityScore": 1.8,
        "impactScore": 5.9,
        "source": "product-security@qualcomm.com",
        "type": "Primary"
      }
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  },
  "published": "2025-06-03T06:15:26.590",
  "references": [
    {
      "source": "product-security@qualcomm.com",
      "tags": [
        "Vendor Advisory"
      ],
      "url": "https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html"
    }
  ],
  "sourceIdentifier": "product-security@qualcomm.com",
  "vulnStatus": "Analyzed",
  "weaknesses": [
    {
      "description": [
        {
          "lang": "en",
          "value": "CWE-822"
        }
      ],
      "source": "product-security@qualcomm.com",
      "type": "Primary"
    }
  ]
}


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  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
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