tid-105
Vulnerability from emb3d
Type
Description

A threat actor with physical access to a device may be able to manipulate the processor’s intended code execution by subjecting it to hardware faults or “glitching”. Hardware faults can be induced by various methods, including voltage fault injection (power glitching), electromagnetic pulses (EM glitching), and optical fault injection. Glitching can be used to bypass various security protections on a device, such as skipping a firmware integrity check during a secure boot process or protections against firmware or data read-out from the device. This threat requires physical access to the device to perform the glitching, and also typically requires substantial iterative testing to identify the precise nature, magnitude, and timing of signals that need to be injected to cause the glitch condition.

CWE
  • CWE-1247: Improper Protection Against Voltage and Clock Glitches (Base)
  • CWE-1319: Improper Protection against Electromagnetic Fault Injection (EM-FI) (Base)


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Sightings

Author Source Type Date

Nomenclature

  • Seen: The vulnerability was mentioned, discussed, or seen somewhere by the user.
  • Confirmed: The vulnerability is confirmed from an analyst perspective.
  • Exploited: This vulnerability was exploited and seen by the user reporting the sighting.
  • Patched: This vulnerability was successfully patched by the user reporting the sighting.
  • Not exploited: This vulnerability was not exploited or seen by the user reporting the sighting.
  • Not confirmed: The user expresses doubt about the veracity of the vulnerability.
  • Not patched: This vulnerability was not successfully patched by the user reporting the sighting.


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